Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Harimatec Inc. |
Series | HF212 |
Package | Bulk |
Product Status | Obsolete |
Type | Solder Paste |
Composition | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
Diameter | - |
Melting Point | 409 ~ 424°F (209 ~ 218°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | - |
Process | Lead Free |
Form | Jar, 17.64 oz (500g) |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
Shipping Info | - |
Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 27 AWG, 28 SWG Spool, 8.8 oz (250g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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