Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.032" (0.81mm) |
Flux Type | No-Clean |
Form | Spool, 1 lb (454 g) |
Melting Point | 423°F (217°C) |
Mfr | Harimatec Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | C400 |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | 59°F ~ 86°F (15°C ~ 30°C) |
Type | Wire Solder |
Weight | 0.55 lb (249.48 g) |
Wire Gauge | 20 AWG, 21 SWG |
Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 23 AWG, 24 SWG Spool, 8.8 oz (250g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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