Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | SMDLTL |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 0.53 oz (15g) |
Melting Point | 281°F (138°C) |
Mesh Type | 4 |
Mfr | Chip Quik Inc. |
Package | Jar |
Process | Lead Free |
Product Status | Active |
Series | - |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
Type | Solder Paste, Two Part Mix |
Wire Gauge | - |
Leaded Rosin Activated (RA) Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 23 AWG, 24 SWG Spool, 8.8 oz (250g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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