Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.022" (0.56mm) |
Flux Type | Water Soluble |
Form | Spool, 8.8 oz (250g) |
Melting Point | 423°F (217°C) |
Mfr | Harimatec Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Obsolete |
Series | Hydro-X |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | - |
Type | Wire Solder |
Weight | - |
Wire Gauge | 23 AWG, 24 SWG |
Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 27 AWG, 28 SWG Spool, 8.8 oz (250g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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