Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Laird Technologies - Thermal Materials |
Series | Tflex™ HD80000 |
Package | Bulk |
Product Status | Active |
Usage | - |
Type | Gap Filler Pad, Sheet |
Shape | Square |
Outline | 228.60mm x 228.60mm |
Thickness | 0.200" (5.08mm) |
Material | Silicone, Ceramic Filled |
Adhesive | - |
Backing, Carrier | - |
Color | Teal |
Thermal Resistivity | - |
Thermal Conductivity | 6.0W/m-K |
Shelf Life | 12 Months |
Shelf Life Start | Date of Certification |
Storage/Refrigeration Temperature | 32°F ~ 95°F (0°C ~ 35°C) |
Digi-Key Storage | Room Temperature |
Base Product Number | A17883 |
GCS-080NS-1.0
THERM PAD 200MMX200MM GRAY
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QB1111A40WYTB
THERMAL CONDUCTOR Q-BRIDGE
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QB2525A60WSTB
THERMAL CONDUCTOR Q-BRIDGE
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QB0805B40WYTD
THERMAL CONDUCTOR Q-BRIDGE
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Thermal Pad 2.03mm x 1.27mm Rectangular
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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