Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Laird Technologies - Thermal Materials |
Series | Tflex™ UT20000 |
Package | Bulk |
Product Status | Active |
Usage | - |
Type | Gap Filler Pad, Sheet |
Shape | Square |
Outline | 228.60mm x 228.60mm |
Thickness | 0.0080" (0.203mm) |
Material | Silicone, Ceramic Filled |
Adhesive | - |
Backing, Carrier | - |
Color | Gray |
Thermal Resistivity | - |
Thermal Conductivity | 3.0W/m-K |
Shelf Life | 24 Months |
Shelf Life Start | Date of Shipment |
Storage/Refrigeration Temperature | - |
Base Product Number | A17682 |
BSC 70 1TT50 1GF50
THERMAL INTERFACE 400MM X 334MM
$26.220000 View More
BSC 100 1GF50
THERMAL INTERFACE 400MM X 334MM
$23.030000 View More
BSC 70 1TT50
THERMAL INTERFACE 400MM X 334MM
$20.190000 View More
BSC 100 HTG
THERMAL INTERFACE 400MM X 334MM
$19.490000 View More
BSC 70
THERMAL INTERFACE 400MM X 334MM
$60.000000 View More
Thermal Pad White 400.00mm x 334.00mm Rectangular
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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Simple returns policy