Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Chip Quik Inc. |
Series | - |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 4 |
Process | Lead Free |
Form | Syringe, 1.23 oz (35g), 10cc |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
Shipping Info | - |
Base Product Number | TS391S |
CWSN60WRMAP3 .062
60/40 WRMAP3 .062 DIA 1# SPL
$43.410000 View More
CWSN60WRAP3 .062
SN60PB40 WRAP3 .062 DIA 1# SPL
$43.410000 View More
CWSN63 NCCW2 .062
SN63PB37 NO CLEAN CORE WIRE 1#
$43.410000 View More
CWSN63 NCCW2 .032
SN63PB37 NO CLEAN CORE WIRE 1# S
$47.210000 View More
CWSN63WRAP3 .062
SN63PB37 WRAP3 .062 DIA !# SPL
$43.410000 View More
Wire Solder Sn63Pb37 (63/37) Spool, 1 lb (453.59g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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Simple returns policy