Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Laird Technologies - Thermal Materials |
Series | Tflex™ HD90000 |
Package | Box |
Product Status | Active |
Usage | - |
Type | Gap Filler Pad, Sheet |
Shape | Square |
Outline | 228.60mm x 228.60mm |
Thickness | 0.0492" (1.250mm) |
Material | Silicone, Ceramic Filled |
Adhesive | Tacky - Both Sides |
Backing, Carrier | - |
Color | Gray |
Thermal Resistivity | - |
Thermal Conductivity | 7.5W/m-K |
Shelf Life | 24 Months |
Shelf Life Start | Date of Shipment |
Storage/Refrigeration Temperature | - |
Base Product Number | A17752 |
BSC 80 HTG 1TT50
THERMAL INTERFACE 400MM X 334MM
$27.630000 View More
BSC 70 2TT50
THERMAL INTERFACE 400MM X 334MM
$35.430000 View More
BSC 70 HTG
THERMAL INTERFACE 400MM X 334MM
$16.650000 View More
BSC 100 2GF50
THERMAL INTERFACE 400MM x 334MM
$26.020000 View More
BSC 80 HTG 2GF50
THERMAL INTERFACE 400MM X 334MM
$34.370000 View More
Thermal Pad White 400.00mm x 334.00mm Rectangular
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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