Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Laird Technologies - Thermal Materials |
Series | Tflex™ HD700 |
Package | Box |
Product Status | Active |
Usage | - |
Type | Gap Filler Pad, Sheet |
Shape | Square |
Outline | 228.60mm x 228.60mm |
Thickness | 0.0600" (1.524mm) |
Material | Silicone, Ceramic Filled |
Adhesive | Tacky - One Side |
Backing, Carrier | - |
Color | Pink |
Thermal Resistivity | - |
Thermal Conductivity | 5.0W/m-K |
Shelf Life | 24 Months |
Shelf Life Start | Date of Shipment |
Storage/Refrigeration Temperature | - |
Base Product Number | A17690 |
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Thermal Pad 1.27mm x 1.27mm Square
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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