Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Harimatec Inc. |
Series | HF212 |
Package | Bulk |
Product Status | Obsolete |
Type | Solder Paste |
Composition | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
Diameter | - |
Melting Point | 411 ~ 424°F (209 ~ 218°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | - |
Process | Lead Free |
Form | Jar, 21.16 oz (600g) |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
Shipping Info | - |
EBSN96.5AG3
SN96.5AG3CU.5 1# BAR
$92.100000 View More
CWSN99.3 WRMAP3 .015
SN99.3CU.7 WRMAP3 .015 1# SPL
$93.120000 View More
CWSAC WRMAP .015
SN96.5AG3CU.5 WRMAP3 .015 1# SPL
$114.980000 View More
CW SN99.3 .032
SN99.3CU.7 WRAP3 .032 1# SPL
$76.180000 View More
CWSAC RA3% .032 1#
SN96.5AG3CU.5 WRAP3 .032 1# SPL
$94.200000 View More
Wire Solder Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) Spool, 1 lb (453.59g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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