Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | Water Soluble |
Form | Jar, 17.64 oz (500g) |
Melting Point | 423 ~ 424°F (217 ~ 218°C) |
Mesh Type | - |
Mfr | Kester Solder |
Package | Bulk |
Process | Lead Free |
Product Status | Obsolete |
Series | EM808 |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |
Type | Solder Paste |
Wire Gauge | - |
Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 14 AWG, 16 SWG Spool, 1 lb (454 g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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