Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | 24-6040 |
Composition | Sn60Pb40 (60/40) |
Diameter | 0.031" (0.79mm) |
Flux Type | Rosin Mildly Activated (RMA) |
Form | Spool, 1 lb (454 g) |
Melting Point | 361 ~ 374°F (183 ~ 190°C) |
Mfr | Kester Solder |
Package | Bulk |
Process | Leaded |
Product Status | Active |
Series | 285 |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | 50°F ~ 104°F (10°C ~ 40°C) |
Type | Wire Solder |
Wire Gauge | 20 AWG, 22 SWG |
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 21.16 oz (600g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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