Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | SMD291 |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 0.53 oz (15g) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Mesh Type | 4 |
Mfr | Chip Quik Inc. |
Package | Jar |
Process | Lead Free |
Product Status | Active |
Series | - |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
Type | Solder Paste, Two Part Mix |
Wire Gauge | - |
Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 16 AWG, 18 SWG Spool, 1 lb (454 g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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