Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | SMD291 |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 2.12 oz (60g) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Mesh Type | 4 |
Mfr | Chip Quik Inc. |
Package | Jar |
Process | Lead Free |
Product Status | Active |
Series | - |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
Type | Solder Paste, Two Part Mix |
Wire Gauge | - |
CWSAC WRMAP .015
SN96.5AG3CU.5 WRMAP3 .015 1# SPL
$114.980000 View More
CW SN99.3 .032
SN99.3CU.7 WRAP3 .032 1# SPL
$76.180000 View More
CWSAC RA3% .032 1#
SN96.5AG3CU.5 WRAP3 .032 1# SPL
$94.200000 View More
CWSN96.5AG3
SN96.5AG3CU.5 WRAP3 .062 1# SPL
$98.980000 View More
CWSN99.3 WRMAP3 .032
SN99.3CU.7 WRMAP3 .032 1# SPL
$76.200000 View More
Wire Solder Sn99.3Cu0.7 (99.3/0.7) Spool, 1 lb (453.59g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
Contact us 24 hours a day
100% payment protection
Simple returns policy