Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Harimatec Inc. |
Series | - |
Package | Bulk |
Product Status | Obsolete |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423°F (217°C) |
Flux Type | - |
Wire Gauge | - |
Mesh Type | - |
Process | Lead Free |
Form | Cartridge, 21.16 oz (600g) |
Shelf Life | 6 Months |
Shelf Life Start | - |
Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |
Lead Free Rosin Mildly Activated (RMA) Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 27 AWG, 28 SWG Spool, 8.8 oz (250g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
Contact us 24 hours a day
100% payment protection
Simple returns policy