Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | 28-3554 |
Contact Finish - Mating | Nickel Boron |
Contact Finish - Post | Nickel Boron |
Contact Finish Thickness - Mating | 50.0µin (1.27µm) |
Contact Finish Thickness - Post | 50.0µin (1.27µm) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Contact Resistance | - |
Current Rating (Amps) | 1 A |
Features | Closed Frame |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Material Flammability Rating | UL94 V-0 |
Mfr | Aries Electronics |
Mounting Type | Through Hole |
Number of Positions or Pins (Grid) | 24 (2 x 12) |
Operating Temperature | -55°C ~ 250°C |
Package | Bulk |
Pitch - Mating | 0.100" (2.54mm) |
Pitch - Post | 0.100" (2.54mm) |
Product Status | Active |
Series | 55 |
Termination | Solder |
Termination Post Length | 0.110" (2.78mm) |
Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
110-83-320-41-105101
CONN IC DIP SOCKET 20POS GOLD
$0.000000 View More
116-83-316-41-012101
CONN IC DIP SOCKET 16POS GOLD
$0.000000 View More
614-87-328-41-001101
CONN IC DIP SOCKET 28POS GOLD
$0.000000 View More
116-87-316-41-009101
CONN IC DIP SOCKET 16POS GOLD
$0.000000 View More
110-83-328-41-001101
CONN IC DIP SOCKET 28POS GOLD
$0.000000 View More
28 (2 x 14) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
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Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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