Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | - |
Form | Jar, 17.64 oz (500g) |
Melting Point | 423 ~ 424°F (217 ~ 218°C) |
Mesh Type | - |
Mfr | Kester Solder |
Package | Jar |
Process | Lead Free |
Product Status | Obsolete |
Series | - |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Storage/Refrigeration Temperature | - |
Type | Solder Paste |
Weight | 1.1 lbs (499 g) |
Wire Gauge | - |
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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