Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Adhesive | - |
Backing, Carrier | - |
Color | Gray |
Digi-Key Storage | - |
Material | Silicone, Ceramic Filled |
Mfr | Laird Technologies - Thermal Materials |
Outline | 228.60mm x 228.60mm |
Package | Box |
Product Status | Active |
Series | Tflex™ HD7.5 |
Shape | Square |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Thermal Conductivity | 7.5W/m-K |
Thermal Resistivity | - |
Thickness | 0.100" (2.54mm) |
Type | Gap Filler Pad, Sheet |
Usage | - |
BSC 80 HTG
THERMAL INTERFACE 400MM X 334MM
$17.360000 View More
BSC 70 1TT50 1GF50
THERMAL INTERFACE 400MM X 334MM
$26.220000 View More
BSC 100 1GF50
THERMAL INTERFACE 400MM X 334MM
$23.030000 View More
BSC 70 1TT50
THERMAL INTERFACE 400MM X 334MM
$20.190000 View More
BSC 100 HTG
THERMAL INTERFACE 400MM X 334MM
$19.490000 View More
Thermal Pad White 400.00mm x 334.00mm Rectangular
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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Simple returns policy