Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Laird Technologies - Thermal Materials |
Series | Tpli™ 200 |
Package | Bulk |
Product Status | Active |
Usage | - |
Type | Gap Filler Pad, Sheet |
Shape | Square |
Outline | 406.40mm x 406.40mm |
Thickness | 0.140" (3.56mm) |
Material | Boron Nitride Filled |
Adhesive | Adhesive - One Side |
Backing, Carrier | - |
Color | Gray |
Thermal Resistivity | - |
Thermal Conductivity | 6.0W/m-K |
Shelf Life | 24 Months |
Shelf Life Start | Date of Shipment |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
QB1111A40WYS3
THERMAL CONDUCTOR Q-BRIDGE
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QB0505B25WYS3
THERMAL CONDUCTOR Q-BRIDGE
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QB2010A60ESC7
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QB2010A60WSS3
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QB1020B40ESTD
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Thermal Pad 2.54mm x 5.08mm Rectangular
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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