Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.059" (1.50mm) |
Flux Type | No-Clean, Water Soluble |
Form | Spool, 1 lb (453.59g) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | - |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | - |
Type | Wire Solder |
Weight | - |
Wire Gauge | - |
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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