Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Penchem Technologies Sdn Bhd |
Series | TH997 |
Package | Sheet |
Product Status | Active |
Usage | Thermally Conductive |
Type | Gap Filler Pad, Sheet |
Shape | Rectangular |
Outline | 288.00mm x 192.00mm |
Thickness | 0.0790" (2.000mm) |
Material | Silicone |
Adhesive | Tacky - Both Sides |
Backing, Carrier | - |
Color | Blue |
Thermal Resistivity | - |
Thermal Conductivity | 2.4W/m-K |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | 68°F ~ 86°F (20°C ~ 30°C) |
Digi-Key Storage | - |
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Thermal Pad 1.52mm x 0.76mm Rectangular
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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