Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Penchem Technologies Sdn Bhd |
Series | TH997 |
Package | Sheet |
Product Status | Active |
Usage | Thermally Conductive |
Type | Gap Filler Pad, Sheet |
Shape | Rectangular |
Outline | 288.00mm x 192.00mm |
Thickness | 0.118" (3.00mm) |
Material | Silicone |
Adhesive | Tacky - Both Sides |
Backing, Carrier | - |
Color | Blue |
Thermal Resistivity | - |
Thermal Conductivity | 2.4W/m-K |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | 68°F ~ 86°F (20°C ~ 30°C) |
Digi-Key Storage | - |
BSC 70 1TT50 1GF50
THERMAL INTERFACE 400MM X 334MM
$26.220000 View More
BSC 100 1GF50
THERMAL INTERFACE 400MM X 334MM
$23.030000 View More
BSC 70 1TT50
THERMAL INTERFACE 400MM X 334MM
$20.190000 View More
BSC 100 HTG
THERMAL INTERFACE 400MM X 334MM
$19.490000 View More
BSC 70
THERMAL INTERFACE 400MM X 334MM
$60.000000 View More
Thermal Pad White 400.00mm x 334.00mm Rectangular
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
Contact us 24 hours a day
100% payment protection
Simple returns policy