Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Penchem Technologies Sdn Bhd |
Series | TH994 |
Package | Sheet |
Product Status | Active |
Usage | Thermally Conductive |
Type | Gap Filler Pad, Sheet |
Shape | Rectangular |
Outline | 288.00mm x 192.00mm |
Thickness | 0.0197" (0.500mm) |
Material | Silicone |
Adhesive | Tacky - Both Sides |
Backing, Carrier | - |
Color | Gray |
Thermal Resistivity | - |
Thermal Conductivity | 8.0W/m-K |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
BSC 70 HTG
THERMAL INTERFACE 400MM X 334MM
$16.650000 View More
BSC 100 2GF50
THERMAL INTERFACE 400MM x 334MM
$26.020000 View More
BSC 80 HTG 2GF50
THERMAL INTERFACE 400MM X 334MM
$34.370000 View More
BSC 70 1GF50
THERMAL INTERFACE 400MM X 334MM
$19.490000 View More
BSC 70 2GF50
THERMAL INTERFACE 400MM X 334MM
$26.570000 View More
Thermal Pad White 400.00mm x 334.00mm Rectangular
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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