Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Syringe, 1.23 oz (34.869g) |
Melting Point | 423°F (217°C) |
Mesh Type | 4 |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | - |
Product Status | Active |
Series | CHIPQUIK® |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
Type | Solder Paste |
Weight | - |
Wire Gauge | - |
EB SN63PB37 1#QA
ELECTTROLYTIC GRADE AAAA
$67.250000 View More
EBSN60PB40 1#QA
ELECTTROLYTIC GRADE AAAA
$67.250000 View More
CWSN99.3.062 1#
SN99.3CU.7 WRAP3 .062 1# SPL
$74.200000 View More
EBSN99.3CU.7 1#
SN99.3CU.7 1# BAR
$68.280000 View More
CWSN99.3 WRAP3.015
SN99.3/CU.7 WRAP3 .015 1# SPL
$93.120000 View More
Wire Solder Sn99.3Cu0.7 (99.3/0.7) Spool, 1 lb (453.59g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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