Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 8.8 oz (250g) |
Melting Point | 280°F (138°C) |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | Leaded |
Product Status | Active |
Series | - |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Storage/Refrigeration Temperature | 32°F ~ 77°F (0°C ~ 25°C) |
Type | Solder Paste |
Weight | - |
Wire Gauge | - |
Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 23 AWG, 24 SWG Spool, 1 lb (454 g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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