Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Chip Quik Inc. |
Series | CHIPQUIK® |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter | - |
Melting Point | 281°F (138°C) |
Flux Type | Water Soluble |
Wire Gauge | - |
Mesh Type | 4 |
Process | Lead Free |
Form | Jar, 17.64 oz (500g) |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Base Product Number | WS991 |
Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 22 AWG, 23 SWG Spool, 1 lb (454 g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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