Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | TS991S |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 17.64 oz (500g) |
Melting Point | 423°F (217°C) |
Mesh Type | 4 |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | CHIPQUIK® |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Type | Solder Paste |
Wire Gauge | - |
Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 14 AWG, 16 SWG Spool, 1 lb (454 g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
Contact us 24 hours a day
100% payment protection
Simple returns policy