Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Chip Quik Inc. |
Series | CHIPQUIK® |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423°F (217°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 3 |
Process | Lead Free |
Form | Jar, 17.64 oz (500g) |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Base Product Number | TS991S |
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Cartridge
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
Contact us 24 hours a day
100% payment protection
Simple returns policy