Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | SMD291 |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 1.41 oz (40g) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Mesh Type | 7 |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | - |
Product Status | Active |
Series | - |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Type | Solder Paste |
Wire Gauge | - |
CWSnCu0.7Ni RMA3% .062 1#
CW SnCu0.7Ni WRMAP 3% 0.062 1# S
$89.990000 View More
CWSnCu0.7Ni NCCW2.2% .062 1#
CW SnCu0.7Ni NCCW 2.2% 0.062 1#
$89.990000 View More
CWSN63WRMAP3 0.62
SN63PB37 WRMAP3 .062 DIA 1# SPL
$43.410000 View More
CWSN60WRMAP3 .062
60/40 WRMAP3 .062 DIA 1# SPL
$43.410000 View More
CWSN60WRAP3 .062
SN60PB40 WRAP3 .062 DIA 1# SPL
$43.410000 View More
Wire Solder Sn60Pb40 (60/40) Spool, 1 lb (453.59g)
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Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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