Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | NC191 |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Syringe, 0.53 oz (15g), 5cc |
Melting Point | 422 ~ 428°F (217 ~ 220°C) |
Mesh Type | 5 |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | Smooth Flow™ |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Type | Solder Paste |
Wire Gauge | - |
Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 16 AWG, 18 SWG Spool, 1 lb (454 g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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