Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | 248 |
Board Material | - |
Contact Finish - Mating | Gold |
Contact Finish - Post | Gold |
Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
Contact Finish Thickness - Post | 30.0µin (0.76µm) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Convert From (Adapter End) | DIP, 0.6" (15.24mm) Row Spacing |
Convert To (Adapter End) | DIP, 0.6" (15.24mm) Row Spacing |
Current Rating (Amps) | 1 A |
Features | Closed Frame |
Housing Material | Polysulfone (PSU), Glass Filled |
Material Flammability Rating | UL94 V-0 |
Mfr | 3M |
Mounting Type | Through Hole |
Number of Pins | 48 |
Operating Temperature | -55°C ~ 125°C |
Package | Box |
Pitch - Mating | 0.100" (2.54mm) |
Pitch - Post | 0.100" (2.54mm) |
Product Status | Active |
Series | Textool™ |
Termination | Wire Wrap |
Termination Post Length | 0.620" (15.75mm) |
97-56001-P
SOCKET ADAPTER QFP TO 169PGA
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68-505-110-RC
SOCKET ADAPTER PLCC TO 68PGA
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22-304504-18
SOCKET ADAPTER SOIC TO 22DIP 0.4
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10-665000-00
SCK ADAPT 10P SOIC-W TO SOIC 0.6
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14-35W000-11-RC
SOCKET ADAPT SOIC-W TO 14DIP 0.3
$0.000000 View More
IC Socket Adapter SOIC-W To DIP, 0.3" (7.62mm) Row Spacing Through Hole
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Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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