Integrated Circuits (ICs)
739344 items
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | CQ100G |
Composition | Sn99.244Cu0.7 (Ni0.05/Ge0.006) |
Diameter | 0.020" (0.51mm) |
Flux Type | No-Clean |
Form | Spool, 1 lb (454 g) |
Melting Point | 441°F (227°C) |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | - |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Type | Wire Solder |
Wire Gauge | - |
Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 23 AWG, 24 SWG Spool, 1 lb (454 g)
Shipping | Use DHL Express by default |
Delivery |
Will usually ship within 3 bussiness day. |
Over 3000 USD and under 1KG
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